COPPER PLATING PROCESS
CYANIDE COPPER

PROCESS

OPERATING CONDITIONS

APPLICATION

CUPROCYN 3161

CUPROCYN 3161
TEMPERATURE
CURRENT DENSITY
100 – 150g/l
40 – 60 C
1 – 2 A/dm
General purpose cyanide copper plating process
to produce light as well as heavy deposits.
Suitable both for vat and barrel plating.
CUPROCYN 3156

CUPROCYN 3156
TEMPERATURE
CURRENT DENSITY
125 – 175g/l
40 – 60 C
1 – 3 A/dm
Produce smooth ROCHELLE copper deposits.

CUPROCYN BRIGHT 3142

CUPROCYN BRIGHT 3142
CUPROCYN 3142 A
CUPROCYN 3142 B
CUPROCYN 3142 NEW CHEL
TEMPERATURE
CURRENT DENSITY
125 – 150g/l
1 – 2 ml/l
3 – 5 ml/l
25 – 35 ml/l
40 – 60 C
3 – 5 A/dm
Produces smooth bright deposits specially
used for high current density operations.
Best product for barrel plating on zinc base dies castings.
ACID COPPER

PROCESS

OPERATING CONDITIONS

APPLICATION

CUPRACID 3172

COPPER SULPHATE
SULPHURIC ACID
CUPRACID 3172
CUPRACID 3173
CHLORIDE ION
TEMPERATURE
CURRENT DENSITY
200 – 250g/l
25 – 35 ml/l
4 – 6 ml/l
0.4 – 0.8 ml/l
100 – 130 ppM
20 – 30 c
2 – 6 A/dm
Process has wide range of brightness, especially at low current density areas.
Has a wide useful operating range, so the solution control is easy.
Good bright throwing power.
CUPRACID 3192

COPPER SULPHATE
SULPHURIC ACID
CUPRACID 3192
CUPRACID 3193
CHLORIDE ION
TEMPERATURE
CURRENT DENSITY
200 – 250g/l
25 – 35 ml/l
4 – 8 ml/l
0.4 – 0.8 ml/l
100 – 130 ppM
20 – 30 c
2 – 6 A/dm
A new generation Bright Acid Copper process producing spectacular leveling.
Highly stable brightener system.
Specially designed for plating on plastics.
Also suitable for barrel plating
CUPRACID 3185

COPPER SULPHATE
SULPHURIC ACID
CUPRACID 3185
CUPRACID 3186
CHLORIDE ION
TEMPERATUR
CURRENT DENSITY
200 – 250g/l
25 – 35 ml/l
6 – 10 ml/l
0.4 – 0.8 ml/l
100 – 130 ppm
20 – 35 c
2 – 6 A/dm
High performance bright acid copper electroplating bath.
Highly ductile and extremely bright deposits.
Bath can be operated at a wide bath temperature range