PLATING ON ALUMINIUM

PROCESS OPERATING CONDITIONS

APPLICATION
ALTEK 432

ALTEK 432
TIME
TEMPERATURE
200 – 500 ml/1
5 – 60 sec
AMBIENT
Dilute zincate solution which produces excellent
adhesion of nickel, copper and other deposits on Aluminium.
ALTEK 434

ALTEK 434
TIME
TEMPERATURE
FULL STRENGTH
15 secs – 2 mins
AMBIENT
A much advanced Zincate process for activating
the aluminum alloy by forming a thin adherent zinc coating by immersion.
Used extensively on aluminium wheels.
TIN PLATING PROCESS
ACID TIN PLATING

PROCESS

OPERATING CONDITIONS

APPLICATION
TUNDRA ACID TIN 260STANNOUS SULPHATE
SULPHURIC ACID
TUNDRA ADDITIVE 261
TUNDRA BRIGHTENER 262
TEMPERATURE
CURRENT DENSITY
20 – 30 g/l
90 – 110 ml/l
30 – 40 ml/l
2 – 4 ml/l
AMBIENT
0.5 – 3.5 A/dm
Produces easily solderable bright tin deposits with excellent tarnish and corrosion resistance.
Designed for vat and barrel process.
Suitable as an etch resistant coating of PC boards.