PLATING ON PLASTICS
PROCESS OPERATING CONDITIONS

APPLICATION
ETCHANT 821

ETCHANT 821
SULPHURIC ACID(TECHNICAL)
TEMPERATURE
TIME


60 – 70 C
5 – 10 mins
The strongly acid conditioner used to alter
the plastic surface to obtain true adhesion of plate
to plastic without prior mechanical roughening.

ACTIVATOR 834


ACTIVATOR 834 HCL
DEIONIZED WATER
TEMPERATURE
TIME



AMBIENT
2 – 4 mins
An advanced TIN PALLADIUM catalyst
solution which catalyses the ABS plastic surface
to influence the metal deposition from subsequent
electroless nickel or copper bath.

SAVORY 640 ELECTROLESS NICKEL

SAVORY 640
ELECTROLESS NICKEL
TEMPERATURE
pH
TIME
A highly stable room temperature electroless
nickel bath to deposit uniform conductive nickel coating on ABS plastics.