TIN PLATING PROCESS
ACID TIN PLATING

PROCESS OPERATING CONDITIONS

APPLICATION
TUNDRA ACID TIN 260

STANNOUS SULPHATE
SULPHURIC ACI
TUNDRA ADDITIVE 261
TUNDRA BRIGHTENER 262
TEMPERATURE
CURRENT DENSITY
20 – 30 g/l
90 – 110 ml/l
30 – 40 ml/1
2 – 4 ml/l
AMBIENT
0.5 – 3.5 A/dm
Produces easily solderable bright tin deposits with
excellent tarnish and corrosion resistance.
Designed for vat and barrel process.
Suitable as an etch resistant coating of PC boards.